Advanced Packaging for Microelectronic and Microsystem Applications
| Publisher: | Vdm Verlag Dr Mueller E K |
| Published In: | 26-Nov-2008 |
| ISBN-10: | 3639096762 |
| ISBN-13: | 9783639096767 |
| Binding Type: | Paperback |
| Weight: | 207 gms |
| Pages: | pp. 116, 23:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on White w/Gloss Lam |
The Title "Advanced Packaging for Microelectronic and Microsystem Applications" is written by Travis Anderson. This book was published in the year 2620. The ISBN number 3639096762|9783639096767 is assigned to the Paperback version of this title. This book has total of pp. 116 (Pages). The publisher of this title is Vdm Verlag Dr Mueller E K. Advanced Packaging for Microelectronic and Microsystem Applications is currently Available with us.