Articles On Packaging (microfabrication), including Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, Flip Chip, Staggered Pin Grid Array, Integrated Circuit Encapsulation
by Hephaestus Books
| Publisher: | Unknown |
| Published In: | 01-Oct-2011 |
| ISBN-10: | 1244884669 |
| ISBN-13: | 9781244884663 |
| Binding Type: | Paperback |
| Weight: | 359 gms |
| Pages: | pp. 160, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Articles On Packaging (microfabrication), including Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, Flip Chip, Staggered Pin Grid Array, Integrated Circuit Encapsulation" is written by Hephaestus Books. This book was published in the year 0120. The ISBN number 1244884669|9781244884663 is assigned to the Paperback version of this title. This book has total of pp. 160 (Pages). The publisher of this title is Unknown. Articles On Packaging (microfabrication), including Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, Flip Chip, Staggered Pin Grid Array, Integrated Circuit Encapsulation is currently Not Available with us.You can enquire about this book and we will let you know the availability.