Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging.
by Karan Kacker
| Publisher: | Unknows |
| Published In: | 03-Sep-2011 |
| ISBN-10: | 1243590726 |
| ISBN-13: | 9781243590725 |
| Binding Type: | Paperback |
| Weight: | 366 gms |
| Pages: | pp. 164, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging." is written by Karan Kacker. This book was published in the year 0320. The ISBN number 1243590726|9781243590725 is assigned to the Paperback version of this title. This book has total of pp. 164 (Pages). The publisher of this title is Unknows. Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging. is currently Not Available with us.You can enquire about this book and we will let you know the availability.