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Design Study of Wafer Seals for Future Hypersonic Vehicles

by  Patrick H. Dunlap
Design Study of Wafer Seals for Future Hypersonic Vehicles,1287247024,9781287247029

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Book Information

Publisher:Unknows
Published In:23-Jul-2013
ISBN-10:1287247024
ISBN-13:9781287247029
Binding Type:Paperback
Weight:93 gms
Pages:pp. 26, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss

The Title "Design Study of Wafer Seals for Future Hypersonic Vehicles" is written by Patrick H. Dunlap. This book was published in the year 2320. The ISBN number 1287247024|9781287247029 is assigned to the Paperback version of this title. This book has total of pp. 26 (Pages). The publisher of this title is Unknows. Design Study of Wafer Seals for Future Hypersonic Vehicles is currently Not Available with us.You can enquire about this book and we will let you know the availability.