Development and fabrication of packaging methodologies compatible with spray cooling of power electronic modules.
by Kiran Kumar Vanam
| Publisher: | Unknows |
| Published In: | 08-Sep-2011 |
| ISBN-10: | 1243715421 |
| ISBN-13: | 9781243715425 |
| Binding Type: | Paperback |
| Weight: | 418 gms |
| Pages: | pp. 194, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Development and fabrication of packaging methodologies compatible with spray cooling of power electronic modules." is written by Kiran Kumar Vanam. This book was published in the year 0820. The ISBN number 1243715421|9781243715425 is assigned to the Paperback version of this title. This book has total of pp. 194 (Pages). The publisher of this title is Unknows. Development and fabrication of packaging methodologies compatible with spray cooling of power electronic modules. is currently Not Available with us.You can enquire about this book and we will let you know the availability.