Development of 3D VLSI integration technology using copper-plated through silicon vias, copper post assembly, and fluid cooling.
by Yang Liu
| Publisher: | Unknows |
| Published In: | 08-Sep-2011 |
| ISBN-10: | 1243715812 |
| ISBN-13: | 9781243715814 |
| Binding Type: | Paperback |
| Weight: | 549 gms |
| Pages: | pp. 270, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Development of 3D VLSI integration technology using copper-plated through silicon vias, copper post assembly, and fluid cooling." is written by Yang Liu. This book was published in the year 0820. The ISBN number 1243715812|9781243715814 is assigned to the Paperback version of this title. This book has total of pp. 270 (Pages). The publisher of this title is Unknows. Development of 3D VLSI integration technology using copper-plated through silicon vias, copper post assembly, and fluid cooling. is currently Not Available with us.You can enquire about this book and we will let you know the availability.