Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly.
by Adam James Boesenberg
| Publisher: | Unknows |
| Published In: | 17-Jul-2012 |
| ISBN-10: | 1249082684 |
| ISBN-13: | 9781249082682 |
| Binding Type: | Paperback |
| Weight: | 327 gms |
| Pages: | pp. 126 |
The Title "Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly." is written by Adam James Boesenberg. This book was published in the year 1720. The ISBN number 1249082684|9781249082682 is assigned to the Paperback version of this title. This book has total of pp. 126 (Pages). The publisher of this title is Unknows. Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly. is currently Not Available with us.You can enquire about this book and we will let you know the availability.