Development of an experimental and analytical model of an active cooling method for high-power three-dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules.
by Huy Ngoc Phan
| Publisher: | Unknows |
| Published In: | 17-Jul-2012 |
| ISBN-10: | 1249060397 |
| ISBN-13: | 9781249060390 |
| Binding Type: | Paperback |
| Weight: | 346 gms |
| Pages: | pp. 136 |
The Title "Development of an experimental and analytical model of an active cooling method for high-power three-dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules." is written by Huy Ngoc Phan. This book was published in the year 1720. The ISBN number 1249060397|9781249060390 is assigned to the Paperback version of this title. This book has total of pp. 136 (Pages). The publisher of this title is Unknows. Development of an experimental and analytical model of an active cooling method for high-power three-dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules. is currently Not Available with us.You can enquire about this book and we will let you know the availability.