Fabrication and testing of apparatus for electrochemical mechanical polishing (ECMP) of copper for semiconductor applications.
by Samuel Swaroop Munnangi
| Publisher: | Unknows |
| Published In: | 17-Oct-2012 |
| ISBN-10: | 1249829348 |
| ISBN-13: | 9781249829348 |
| Binding Type: | Paperback |
| Weight: | 369 gms |
| Pages: | pp. 148 |
The Title "Fabrication and testing of apparatus for electrochemical mechanical polishing (ECMP) of copper for semiconductor applications." is written by Samuel Swaroop Munnangi. This book was published in the year 1720. The ISBN number 1249829348|9781249829348 is assigned to the Paperback version of this title. This book has total of pp. 148 (Pages). The publisher of this title is Unknows. Fabrication and testing of apparatus for electrochemical mechanical polishing (ECMP) of copper for semiconductor applications. is currently Not Available with us.You can enquire about this book and we will let you know the availability.