High Temperature Electronics Packaging Processes and Materials Development.
by Ping Zheng
| Publisher: | Unknows |
| Published In: | 04-May-2012 |
| ISBN-10: | 1248956745 |
| ISBN-13: | 9781248956748 |
| Binding Type: | Paperback |
| Weight: | 316 gms |
| Pages: | pp. 120 |
The Title "High Temperature Electronics Packaging Processes and Materials Development." is written by Ping Zheng. This book was published in the year 0420. The ISBN number 1248956745|9781248956748 is assigned to the Paperback version of this title. This book has total of pp. 120 (Pages). The publisher of this title is Unknows. High Temperature Electronics Packaging Processes and Materials Development. is currently Not Available with us.You can enquire about this book and we will let you know the availability.