The Mega Online Bookshop
Welcome Guest | Login | Home | Contact Us

Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects.

by  Rongwei Zhang
Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects.,1249046440,9781249046448

Paperback

Available




We have 3 million other books

Find Another Book

Enquire about this book

Book Information

Publisher:Unknows
Published In:17-Jul-2012
ISBN-10:1249046440
ISBN-13:9781249046448
Binding Type:Paperback
Weight:507 gms
Pages:pp. 220

The Title "Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects." is written by Rongwei Zhang. This book was published in the year 1720. The ISBN number 1249046440|9781249046448 is assigned to the Paperback version of this title. This book has total of pp. 220 (Pages). The publisher of this title is Unknows. Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects. is currently Not Available with us.You can enquire about this book and we will let you know the availability.