Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects.
by Rongwei Zhang
Publisher: | Unknows |
Published In: | 17-Jul-2012 |
ISBN-10: | 1249046440 |
ISBN-13: | 9781249046448 |
Binding Type: | Paperback |
Weight: | 507 gms |
Pages: | pp. 220 |
The Title "Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects." is written by Rongwei Zhang. This book was published in the year 1720. The ISBN number 1249046440|9781249046448 is assigned to the Paperback version of this title. This book has total of pp. 220 (Pages). The publisher of this title is Unknows. Novel conductive adhesives for electronic packaging applications A way towards economical, highly conductive, low temperature and flexible interconnects. is currently Not Available with us.You can enquire about this book and we will let you know the availability.