Packaging and Embedded Electronics for the Next Generation
by Michael J. Sampson
| Publisher: | Unknows |
| Published In: | 29-Jul-2013 |
| ISBN-10: | 1289250561 |
| ISBN-13: | 9781289250560 |
| Binding Type: | Paperback |
| Weight: | 90 gms |
| Pages: | pp. 24, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Packaging and Embedded Electronics for the Next Generation" is written by Michael J. Sampson. This book was published in the year 2920. The ISBN number 1289250561|9781289250560 is assigned to the Paperback version of this title. This book has total of pp. 24 (Pages). The publisher of this title is Unknows. Packaging and Embedded Electronics for the Next Generation is currently Not Available with us.You can enquire about this book and we will let you know the availability.