Quality inspection and reliability study of solder bumps in packaged electronic devices Using laser ultrasound and finite element methods.
by Jin Yang
| Publisher: | Unknows |
| Published In: | 03-Sep-2011 |
| ISBN-10: | 1243589701 |
| ISBN-13: | 9781243589705 |
| Binding Type: | Paperback |
| Weight: | 696 gms |
| Pages: | pp. 298 |
The Title "Quality inspection and reliability study of solder bumps in packaged electronic devices Using laser ultrasound and finite element methods." is written by Jin Yang. This book was published in the year 0320. The ISBN number 1243589701|9781243589705 is assigned to the Paperback version of this title. This book has total of pp. 298 (Pages). The publisher of this title is Unknows. Quality inspection and reliability study of solder bumps in packaged electronic devices Using laser ultrasound and finite element methods. is currently Not Available with us.You can enquire about this book and we will let you know the availability.