Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.
by Krishna Rajaram Tunga
| Publisher: | Unknows |
| Published In: | 19-Oct-2011 |
| ISBN-10: | 1244947199 |
| ISBN-13: | 9781244947191 |
| Binding Type: | Paperback |
| Weight: | 231 gms |
| Pages: | pp. 86 |
The Title "Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry." is written by Krishna Rajaram Tunga. This book was published in the year 1920. The ISBN number 1244947199|9781244947191 is assigned to the Paperback version of this title. This book has total of pp. 86 (Pages). The publisher of this title is Unknows. Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry. is currently Not Available with us.You can enquire about this book and we will let you know the availability.