Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in aluminum (copper) interconnects and lead-free solder joints.
by Kai Chen
| Publisher: | Unknows |
| Published In: | 08-Sep-2011 |
| ISBN-10: | 1243733764 |
| ISBN-13: | 9781243733764 |
| Binding Type: | Paperback |
| Weight: | 335 gms |
| Pages: | pp. 146, 50:B&W 7.44 x 9.69 in or 246 x 189 mm (Crown 4vo) Perfect Bound on White w/Gloss |
The Title "Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in aluminum (copper) interconnects and lead-free solder joints." is written by Kai Chen. This book was published in the year 0820. The ISBN number 1243733764|9781243733764 is assigned to the Paperback version of this title. This book has total of pp. 146 (Pages). The publisher of this title is Unknows. Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in aluminum (copper) interconnects and lead-free solder joints. is currently Not Available with us.You can enquire about this book and we will let you know the availability.